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专利名称：Method of manufacturing and testing an
electronic device, and an electronic device
发明人：Mark E. Tuttle,Rickie C. Lake,Curtis M.
Medlen
申请号：US09767593申请日：20010122
公开号：US20010002106A1公开日：20010531
摘要：A method of manufacturing and testing an electronic circuit, the methodcomprising forming a plurality of conductive traces on a substrate and providing a gap inone of the conductive traces; attaching a circuit component to the substrate and couplingthe circuit component to at least one of the conductive traces; supporting a battery onthe substrate, and coupling the battery to at least one of the conductive traces, whereina completed circuit would be defined, including the traces, circuit component, andbattery, but for the gap; verifying electrical connections by performing an in circuit test,after the circuit component is attached and the battery is supported; and employing ajumper to electrically close the gap, and complete the circuit, after verifying electricalconnections. An electronic circuit comprising a substrate; a plurality of conductive traceson the substrate, with a gap in one of the conductive traces; a circuit component attachedto the substrate and coupled to at least one of the conductive traces; a battery
supported on the substrate and coupled to at least one of the conductive traces, whereina completed circuit would be defined, including the traces, circuit component, andbattery, but for the gap; and a jumper electrically closing the gap and completing the
circuit, the jumper comprising conductive epoxy.
申请人：TUTTLE MARK E.,LAKE RICKIE C.,MEDLEN CURTIS M.
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