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专利名称：Device, device and method for detecting
work
发明人：小田 喜文申请号：JP2017238161申请日：20171212公开号：JP2019105532A公开日：20190627
专利附图：
摘要：Problem to be solved: to provide a work detecting apparatus, a film formingapparatus and a work detecting method capable of detecting an abnormality of aposition of a workpiece, such as warp, without being influenced by the surface propertyof the workpiece by a common detecting means. A first setting part for setting a firstregion S1 of a predetermined size and aGreater than the first area S1A second settingportion for setting a second region S2 in which all the first regions S1 are fully
accommodated andThe reflected image of the reflected light from the wafer housed inthe holder isA detection part for detecting a value corresponding to the area of the
region overlapping the region between the first region S1 and the second region S2andThe value detected by the detector isBased on whether or not the thresholdexceedsA decision section for determining whether or not the position of the wafer isabnormal with respect to the holder is.Diagram
申请人：芝浦メカトロニクス株式会社
地址：神奈川県横浜市栄区笠間２丁目５番１号
国籍：JP
代理人：木内 光春
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